Features:
The SIPLACE HF-3 placement
the system is particularly suitable
for applications that demand
a high level of flexibility,
utmost precision, and a high
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Vintage: Year 2006
PCB Direction: Left to Right
Heads:
Condition: Refurbished, working
Running Hours:
Series Number:
Feeders:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
SMD Machine/SMT Pick And Place Machine/Chip Shooter/SMD Mounter SIPLACE HF-3
On March 17-19, 2004, at the Munich Shanghai Electronics Show (epChina 2004) held at the Shanghai New International Exhibition Center, Siemens Dematic launched the latest placement machine – SIPLACE HF/3 (Siemens placement machine HF3 High-speed general-purpose machine), this is the first appearance of this type of placement machine in China and even the Asian market. Siemens placement machine HF3 was the most flexible and advanced three-cantilever placement machine in the world at that time
Material station: 180
SMT head: 3 X-Y axis cantilevers, 24 nozzle placement heads, 2 large IC nozzle heads
Mounting speed: 40000/H
Mounting accuracy: ±60 microns standard, ±55 microns DCA, ±0.7°/(4σ)
PCB thickness 0.3-4.5 mm (requires thicker PCBs)
Siemens HF3 placement machine can paste PCB size:
In single track: PCB from 50mm*50mm to 450mm*508mm;
50mm*80mm to 610mm*508mm (“Longboard” option)
In double track: PCB from 50*50mm to 450mm*250mm
50*80mm to 610mm*250mm (“Longboard” option)
The range of components that Siemens HF3 placement machine can mount:
From the smallest 0201 or even 01005 chips all the way to flip chips, CCGAs and odd-shaped components weighing 100 grams and 85 x 85/125 x 10mm in size
