The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The NXT III supports the smallest parts being used in mass production with extreme placing accuracy.
Vintage: Year 2020
PCB Direction: Left to Right
Heads:
Condition: Refurbished, working
Running Hours:
Series Number:
Feeders:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
NXT III Scalable Placement Platforms
The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The NXT III supports the smallest parts being used in mass production with extreme placing accuracy.
Improved Productivity
A faster XY robot and faster tape feeders, as well as a newly developed “flying vision” parts camera, mean increased placing ability for all part sizes and types.
The new H24G high-speed head achieves 37,500 cph (chips per hour) (Productivity priority mode) per module, a 44% improvement from the fastest speed of the NXT II.
* Under conditions at Fuji.
0201 mm Part Support, +/- 0.025 mm Placing Accuracy
As well as supporting the smallest parts currently being used in mass production (0402 mm, 01005″), the NXT III can also handle the next generation of components heading for the market – 0201 mm parts.
By improving machine rigidity and further refining its independent servo control and vision recognition technology, Fuji has achieved a placing accuracy for small chip parts of +/- 0.025 mm* (3sigma, Cpk≥1.00).
* Under conditions at Fuji.
Improved Usability
The GUI of the original NXT was widely praised for making use of intuitive and easy-to-understand pictograms instead of relying on language-based instructions.
This interface is now combined with a touchscreen panel to make operation even easier. This reduces the number of button pushes required and makes selecting commands easier, as well as improving quality by reducing the chance of performing the wrong command.
High Compatibility
Many of the main units from the NXT II such as placing heads, nozzle stations, feeders, tray units, and feeder pallet exchange units can be used on the NXT III without any modifications.
Target circuit board size (LxW):
48mm × 48mm ~ 534mm × 510mm (Dual transport rail specification)
48mm × 48mm ~ 534mm × 610mm (single transport rail specification)
* Maximum 280 mm for dual transport rails (W), and single transport rail transport when it exceeds 280 mm.
Number of components: MAX45 type (8mm tape conversion)
Circuit board loading time:
Double handling rail: O sec during continuous operation, single handling rail: 3.4 sec (M6 III modules are transported between modules)
Module width: 645mm
Machine size: L: 1295mm (M3III × 4, M6III × 2) / 645mm (M3III × 2, M6III) W: 1900.2mm H: 1476mm
Mounting accuracy / coating position accuracy (reference positioning point reference): * The placement accuracy is the measurement result under our company ’s conditions.
H24G: ± 0.025mm (standard mode) /±0.038mm (production priority mode) (3σ) cpk ≧ 1.00
V12 / H12HS: ± 0.038 (± 0.050) mm (3σ) cpk ≧ 1.00
H08M / H04S / H04SF: ± 0.040mm (3σ) cpk ≧ 1.00
H08 / H04 / OF: ± 0.050mm (3σ) cpk ≧ 1.00
H02 / H01 / G04: ± 0.030mm (3σ) cpk ≧ 1.00
H02F / G04F: ± 0.025mm (3σ) cpk ≧ 1.00
GL: ± 0.100mm (3σ) cpk ≧ 1.00
Capacity: * The value of capacity is the measurement result under the conditions of the company.
H24G: 37,500 (production priority mode) / 35,000 (standard mode) cph
V12: 26,000 cph
H12HS: 24,500 cph
H08M: 13,000 cph
H08: 11,500 cph
H04: 6,500 cph
H04S: 9,500 cph
H04SF: 10,500 cph
H02: 5,500 cph
H02F: 6,700cph
H01: 4,200 cph
G04: 7,500 cph
G04F: 7,500 cph
OF: 3,000 cph
GL: 16,363 dph (0.22sec / dot)
Image element:
H24G: 0201 ~ 5mm × 5mm Height: Max 2.0mm
V12 / H12HS: 0402 ~ 7.5mm × 7.5mm Height: Max 3.0mm
H08M: 0603 ~ 45mm × 45mm height: maximum 13.0mm
H08: 0402 ~ 12mm × 12mm Height: Maximum 6.5mm
H04: 1608 ~ 38mm × 38mm height: maximum 9.5mm
H04S / H04SF: 1608 ~ 38mm × 38mm height: maximum 6.5mm
H02 / H02F / H01 / 0F: 1608 ~ 74mm × 74mm (32mm × 180mm) Height: Maximum 25.4mm
G04 / G04F: 0402 ~ 15mm × 15mm height: maximum 6.5mm
Number of nozzles: 12
Capacity (cph): 25,000 components with or without confirmation function ON: 24,000
Image element size (mm): 0402 ~ 7.5 × 7.5 height: maximum 3.0mm
Mounting accuracy (based on the reference positioning point): ± 0.038 (± 0.050) mm (3σ) cpk ≧ 1.00
* ± 0.038mm is the result of mounting (high precision adjustment) of rectangular chip components under the best conditions of our company.
Number of nozzles: 4
Capacity (cph): 11,000
Image element size (mm): 1608 ~ 15 × 15 height: maximum 6.5mm
Mounting accuracy (based on the reference positioning point): ± 0.040mm (3σ) cpk ≧ 1.00
Number of nozzles: 1
Capacity (cph): 47,000
Image element size (mm): 1608 ~ 74 × 74 (32 × 100) height: maximum 25.4mm
Mounting accuracy (based on the reference positioning point): ± 0.030mm (3σ) cpk ≧ 1.00
Intelligent feeder: corresponding to 4 ・ 8 ・ 12 ・ 16 ・ 24 ・ 32 ・ 44 ・ 56 ・ 72 ・ 88 ・ 104mm width tape
Tube feeder: 4 ≦ component width ≦ 15mm (6 ≦ material tube width ≦ 18mm), 15 ≦ component width ≦ 32mm (18 ≦ material tube width ≦ 36mm)
Tray unit: Corresponding tray size 135.9 × 322.6mm (JEDEC specification) (Tray unit-M), 276 × 330mm (Tray unit-LT), 143 × 330mm (Tray unit-LTC)
Options:
Tray feeder, PCUII (feeding bracket replacement unit), MCU (module replacement unit), management computer placement table, FUJICAMXAdapter, Fujitrax