Features:
Vintage: Year 2011
PCB Direction: Left to Right
Heads:
Condition: Refurbished, working
Running Hours:
Series Number:
Feeders:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
SMD Machine/SMT Pick And Place Machine/Chip Shooter/SMD Mounter JUKI FX-3RL
High-speed placement is possible with a new concept laser line sensor (LNC6) that can recognize 6 placement heads at the same time.
High-precision patch improves quietness. Equipped with FCS (Flexible Calibration System, flexible calibration system)
It has the function of automatic identification of placement offset and automatic correction by placement machine.
Automatic Tool Changer (ATC) in matrix configuration, 6 pick and place heads can change nozzles at the same time.
The full buffer and the transmission stepping motor of the station can independently control the speed. Increased operating efficiency.
A new method of detecting substrates is adopted to inspect substrates with missing corners when they are produced, and there is no need to adjust the position of the substrate detection sensor. The automatic teaching components (0402~3216 tape components) are picked up for children, which shortens the preparation time and reduces the error rate of picking up.
HMS (Height Measurement System) is equipped as standard, making it easy to check and teach the pick-up height. Low defect rate The laser sensor of the laser placement head closely monitors the pick-up status of components (until the moment before placement), which can effectively prevent components from falling. Using the automatic correction function at the moment of vacuum pressure destruction, it can effectively prevent the chip from being brought back to the component in an instant. Implementing the motor drive of the substrate support part (support table) avoids vibration when releasing the substrate, prevents deviation after placement, and shortens the clamping and releasing time of the substrate. The use of high vacuum pumps reduces air consumption and improves the stability of component suction.
