Features:
With the addition of the optional MNVC, the component range can be increased even more for greater flexibility.
Vintage: Year 2012
PCB Direction: Left to Right
Heads:
Condition: Refurbished, working
Running Hours:
Series Number:
Feeders:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
SMD Machine/SMT Pick And Place Machine/Chip Shooter/SMD Mounter JUKI KE-2070M
Features of the Laser Centering
A high resolution laser is mounted on the head to center components in all directions including angle. Centering is done on-the-fly, allowing high speed placement of components from small chips to SOPs.
Centering accommodates component variations
Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.
Component check function improves placement reliability
Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.
Vision centering technology
Method can be selected based on component type, shape, size and material. Laser centering is used for high speed placement of smaller components. Vision is used when lead or ball inspection is needed or when the component is too large for the laser. Many nozzles are available for odd-shaped components providing unsurpassed component handling.
General Vision
General vision function is used to support a wide variety of today’s unusual vision centered components. After programming is complete, the data can be verified by picking and test centering a component.
MNVC (Multi-Nozzle Vision Centering)
Vision centering by the multi-nozzle head nearly doubles the placement rate for smaller components, including CSPs, BGAs, and smaller QFPs. (option on KE-2060R/KE-2060/High-speed Chip Shooter KE-2070/High-speed Flexible Mounter KE-2080)
| Board size | M size (330×250mm) | ○ | |
|---|---|---|---|
| L size (410×360mm) | ○ | ||
| L-Wide size(510×360mm) (option) | ○ | ||
| E size (510×460mm)*1 | ○ | ||
| Component size | Laser recognition | 0402 (01005) ～□33.5mm | |
| Vision recognition | Standard camera |  □3mm*2 ～□33.5mm | |
| High-resolution camera (option) | 1.0×0.5mm*3 ～□20mm | ||
| Placement speed | Chip | Optimum | 0.155Sec./chip(23,300CPH) |
| IPC9850 | 18,300CPH | ||
| IC*4 | 4,600CPH*5 | ||
| Placement accuracy | Laser recognition | ±0.05mm（Cpk≧1） | |
| Vision recognition | ±0.04mm | ||
| Feeder inputs | Max. 80 on 8mm T/F*6 | ||
