Features:

Adoption of the light-weight 16-nozzle head V3
Improving Placement tact time by simultaneously driving X-/Y-axes and selecting optimal pathways during component recognition operation.

Advancement of head drive unit motion control
Improving placement tact time by further advancing motion control and thereby reducing X-/Z-axis travel time.

Use of new pickup operation algorithm
Improving effective productivity by enhancing the pickup algorithm for microchips.