Features:
Yamaha YV100XG Chip Mounter
Mounting Speed:16200CPH
Total weight 1600KG
Dimensions 1650*1408*1900
Vintage: Year 2007
PCB Direction: Left to Right
Heads:
Condition: Refurbished, working
Running Hours:
Series Number:
Feeders:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
YAMAHA placement machine YV100XG is a multi-functional and general-purpose placement machine with fully closed-loop and dual-drive technology. It can produce small components at high speed, and can place special-shaped components such as BGA, QFN, and QPF with high precision.
Product introduction: It is a multifunctional and general-purpose placement machine with fully closed-loop and dual-drive technology, which can produce small components at high speed and place special-shaped components such as BGA, QFN, and QPF with high precision.
1. Advantages of YAMAHA placement machine YV100XG:
■ Mounting speed is 0.18 seconds higher/CHIP (best condition)
■ Under the condition of IPC9850, the placement speed is as high as 16.200CPH (converted by 0.22 seconds/CHIP).
■ Mount 0603 chip components, the whole process accuracy is as high as (0603 components, the whole process accuracy is as high as ±50 microns, and the whole process repeatability is as high as ±30 microns).
■ Mounting accuracy: absolute accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP
■ Carry out full solder ball connection identification for CSP/BGA components, including judging whether the solder ball is defective or not.
■ Wide range of application, from 0603 micro components to large -31mm QFP components.
■ Best for producing next-generation memory modules.
■ Using 2 high-resolution multi-vision digital cameras
■ You can choose the flying nozzle head with the patented YAMAHA placement machine, which can effectively reduce the machine idling loss
■ The Y-axis is driven by high-power servo motors and high-rigidity screw rods at the left and right ends. This newly developed fully fixed dual-drive technology
■ In order to accelerate and drive through coordinated synchronization of both ends, the acceleration function has been improved and the positioning time has been shortened.
2. YAMAHA placement machine YV100XG type substrate size:
1. M-Type: L460 x W335～L50 x W50mm / t = 0.4～3.0mm
2. L-Type: L460 x W440～L50 x W50mm / t = 0.4～3.0mm
3. ※ATS20A use: L460 x W250～L50 x W50mm
1) High-speed and high-precision multi-functional modular placement machine
2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour)
3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP)
4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns
5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components
6) Using 2 high resolution multi-vision digital cameras
7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls
8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss
9) The best choice for universal type
10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.
This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination
through both ends to drive and completes the acceleration function. Reduced positioning time.
Board size M type: L460*W335(MAX)-L50*W50(MIN)
L type: L460*W440(MAX)-L50*W50(MIN)
Mounting Accuracy Absolute Accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP
Mounting speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH
Mountable Components:
0603-31mm Components, SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA
Dimensions 1650*1408*1900
Total weight 1600KG
