Materializes quantitative inspection of solder joint and implementation, while minimizing risks of overlooking unknown defects by the quality product criteria inspection based on the standards, contributing to vertical startup of inspection.
Features:
Materializes quantitative inspection of solder joint and implementation, while minimizing risks of overlooking unknown defects by the quality product criteria inspection based on the standards, contributing to the vertical startup of inspection.
Vintage: Year
PCB Direction: Left to Right
Condition: Refurbished, working
Running Hours:
Series Number:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
SMT AOI/SMD AOI/SMT AOI Machine OMRON VT-S530-DU
Omron’s 3D-SJI (Solder Joint Inspection)
Materializes quantitative inspection of solder joint and implementation, while minimizing risks of overlooking unknown defects by the quality product criteria inspection based on the standards, contributing to vertical startup of inspection.
Whole PCB surface inspection
Detecting foreign objects accurately is achieved through combining 3D (height) and 2D (area) measurements on the entire PCB surface. (Lands without solder can be excluded from the inspection)
High productivity inspection
High production throughput supported through dual lane.
Dual lane operation using various PCBs is possible, due to its handling capability up to the PCB size of 510 (W) x 330 (D) mm.
| Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
|---|---|---|
| Weight | Approx. 850kg | |
| Power supply | Voltage | 200 – 240VAC (single phase), voltage fluctuation range ±10% |
| Normal rated power | 2.0kVA | |
| Line height | 900±20mm | |
| Air supply pressure | 0.3 – 0.6MPa | |
| Operating temperature range | 10 – 35°C | |
| Operating humidity range | 35 – 80%RH (Non-condensing) | |
| Image signal input block | Imaging system | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 10μm/15μm | |
| FOV | 10μ: 40×30mm | |
| 15μ: 60×45mm | ||
| Supported PCB size (min.) | 50(W)×50(D)mm |
|---|---|
| Supported PCB size (max.) | Dual lane: 510(W)×330(D)mm |
| Single lane: 510(W)×680(D)mm | |
| Clearance | Above: 50mm; Below: 50mm |
| Height measurement range | 25mm |
| Thickness | 0.4 – 4mm |
| Inspection item | Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |