The KY8030-3 is back, faster than ever using Koh Young’s 3D dual-inspection technology to eliminate critical shadow problems while enhancing productivity and speeding up the production process.
Meet KY8030-3 with multiple resolutions and configurable options to meet the needs of applications.
KOH YOUNG KY8030-3 3D SPI
Vintage: Year 2015
PCB Direction: Left to Right
Condition: Refurbished, working
Running Hours:
Series Number:
Missing Parts: No
Location: China
Warranty: 6 Months after instllation
Lead time: 7 Days
Solder Paste Inspection Machine/SPI Machine/SPI Solder Paste Inspection KOH YOUNG KY8030-3 3D SPI
Full 3D measurement and detection solution
– Solve shadow issues by using bidirectional projection
– Full 3D foreign object detection solution, applicable to the entire PCB
– Provide accurate inspection data with real-time PCB deformation compensation
●Process optimization solution based on full 3D data: realize Industry 4.0 / smart factory
– Real-time process optimization through powerful SPC analysis
– Provide powerful printing process optimization tools
●A leading model suitable for high-speed mass production lines
Resolution | 15um | 20um | 25um |
Inspection time(per FOV) | 0.47sec | 0.47sec | 0.47sec |
Max. PCB size: | |||
Machine Size | M | L | XL |
Max | 330 x 250 mm | 510 x 510 mm | 810 x 610 mm |
FOV Size | 30 x 30mm | ||
3D Inspection Speed | 22.5-56.1cm2/Sec | ||
Distance between deposit | 100 Micrometer | ||
Inspection Size | 10 x 10mm | ||
Inspection Height | 400 Micrometer | ||
PCB Size Handling | 330 X330mm To 850 x 690mm | ||
Air And Power Supplies | Single Phase 200-240vac,50-60hz,5kgf/ Cm2 | ||
