The SPI HS60 Series series is PARMI’s best-selling model. It has been installed in excellent SMT production sites around the world. Its performance stability has been affirmed. The use of Dual Laser has completely overcome the shadow problem, and the use of triangulation measurement method PARMI exclusive 3D The RSC_5 Sensor of MPC (Multiple profile correlation) technology can present a Real 3D Image close to the actual shape. In addition, the Real Time Z-Axis Tracking function is used to consistently provide the detection capability of the board bending.
Vintage: Year 2013
PCB Direction: Left to Right
Condition: Refurbished, working
Missing Parts: No
Warranty: 6 Months after instllation
Lead time: 7 Days
Solder Paste Inspection Machine/SPI Machine/SPI Solder Paste Inspection PARMI HS60 3D
SPI HS60 Series series is the best-selling model of PARMI. It has been installed in good SMT production sites all over the world. The stability of its performance has been affirmed. It adopts Dual Laser to overcome the shadow problem, and uses the triangulation method PARMI rare 3D technology MPC ( Multiple profile correlation) RSC_5 Sensor can present a Real 3D image close to the actual shape, and also use the Real Time Z-Axis Tracking function to consistently provide the ability to detect substrate bending.
The SPI HS60(supreme) series is the next generation of the fastest in-line solder paste inspection system on the market. The measurement speed is 100cm2/sec at 13x13um resolution and 80cm2/sec at 10x10um resolution. It can inspect pads smaller than 01005 and sizes as small as 100um. Based on the RSC-6 sensor developed by PARMI, the HS60 detection cycle time is greatly reduced. Additionally, the camera lens for the RSC sensor is available in two magnifications – 0.42x to 0.6x magnification, giving engineers more control. Main features of 3D sensor “RSC VI”