With industry-leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation, and fringe pattern technology. TRI’s quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.
TRI TR7007 SII Plus Inline 3D SPI
Vintage: Year 2014
PCB Direction: Left to Right
Condition: Refurbished, working
Running Hours:
Series Number:
Missing Parts: No
Location: China
Warranty: 6 Months after instllation
Lead time: 7 Days
Solder Paste Inspection Machine/SPI Machine/SPI Solder Paste Inspection TRI TR7007 SII Plus
TR7007 SII is the fastest solder paste printing inspection machine in the industry, with an inspection speed of up to 200 cm2/sec. The high-precision online shadowless solder paste printing inspection solution provides full 3D inspection with a resolution of 15 µm or 10 µm and a high-precision linear motor platform. Features of this system include closed loop function, enhanced 2D imaging technology, automatic plate bending compensation function and fringe light scanning technology. This series also has a dual-rail structure model, which greatly increases the production capacity of the production line without increasing the floor space of the machine.
Features of TELE TR7007SII:
1. The fastest solder paste printing inspection machine in the industry
2. Shadow-free fringe light detection technology
3. Optical resolution provides two options of 10 µm and 15 µm
4. X-Y table linear motor can provide accurate detection without vibration
| Imaging Method | Dynamic Imaging |
| Camera | 4 Mpix |
| Imaging Resolution | 10 µm or 15 µm (factory setting) |
| Lighting | RGB LED |
| 3D Technology | 2-way Fringe Pattern |
| Field of View | 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
| Imaging Speed | 4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec |
| Height Resolution | 0.4 µm |
| Max. Solder Height | @ 10 µm: 600 µm @ 15 µm: 550 µm |
| X-Axis Control | Linear Motor and linear scale with DSP-based controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 0.5 µm |
| Z-Axis Resolution | 1 µm |
| Max PCB Size | TR7007 SII Plus: 510 x 460 mm TR7007L SII Plus: 660 x 610 mm TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
| WxDxH | TR7007 SII Plus: 1100 x 1570 x 1550 TR7007L SII Plus: 1300 x 1610 x 1560 mm TR7007 SII Plus DL: 1100 x 1770 x 1560 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7007 SII Plus: 950 kg TR7007L SII Plus: 1250 kg TR7007 SII Plus DL: 1100 kg |
