Features:
Image recognition: ± 0.03mm (± 0.04mm when using MNVC (optional)
Component Mounting Type: Up to 80 (converted to 8mm) * 5
One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
Vintage: Year 2012
PCB Direction: Left to Right
Heads:
Condition: Refurbished, working
Running Hours:
Series Number:
Feeders:
Missing Parts: No
Warranty: 6 Months after instllation
Location: China
Lead time: 7 Days
SMD Machine/SMT Pick And Place Machine/Chip Shooter/SMD Mounter JUKI KE-2080L
The newly designed LNC60 high-resolution laser center identification system makes the mounted components more miniaturized (minimum 0.4×0.2mm), and improves the reliability of the laser on the basis of improving the reliability of the tiny components identified by the laser. Structural rigidity and durability. At the same time, it has a high-resolution visual placement head, which can easily perform image recognition on components with a size of 1.0×0.5mm to 50×150mm. It also has an automatic video-teaching function for irregular BGA and special-shaped devices, and supports automatic correction of the pick-up position, so that It reduces the line change time of the production line and improves the reliability of component picking and identification.
Superior general image recognition function:
According to the shape, size, type, etc. of the component, you can choose to use highly versatile image recognition. As long as you simply compile the component image recognition data, the system can automatically complete the partial confirmation and overall confirmation of the component, and the edge and angle of the shape recognition component Confirmation and other operations, further simplifying data input and making functions more complete.
JUKI advanced laser recognition system:
Using the latest laser three-dimensional image recognition technology (LNC60) developed by JUKI, the absorption of components can be monitored by laser scanning before placing components, including the length, width and thickness of components, which can prevent the bad placement of tiny components that cannot be recognized by air pressure. Advanced post-placement component carry-back inspection and die stand inspection functions can significantly reduce missing and small number of bad placements.
XY dual motor drive placement head independent motor drive:
The XY axis adopts the AC servo dual motor drive independently developed by JUKI and combines the non-contact linear magnetic scale to form a fully closed-loop control system, which makes the equipment run stably at high precision and high speed without being affected by dust and temperature. While the placement accuracy is not affected by mechanical wear, it also makes the maintenance of the equipment easier. In addition, when the placement head is moving up and down and rotating, each suction nozzle is controlled by a completely independent AC servo, so that each suction nozzle does not interfere with each other and realizes high-precision control.
rd size | M size (330×250mm) |
| |
L size (410×360mm) |
| ||
L-Wide size(510×360mm) (option) |
| ||
E size (510×460mm)*1 |
| ||
Component size | Laser recognition | 0402 (01005)~33.5mm | |
Vision recognition | Standard camera | 3mm~74mm or 50×150mm | |
High-resolution camera (option) | 1.0×0.5mm*3~48mm or 24×72mm | ||
Placement speed | Chip | Optimum | 0.178Sec./chip(20,200CPH) |
IPC9850 | 16,700CPH | ||
IC*4 | 1,850CPH | ||
4,860CPH*5 | |||
Placement accuracy | Laser recognition | ±0.05mm(Cpk ≥ 1) | |
Vision recognition | ±0.03mm (±0.04mm when using MNVC) | ||
Feeder inputs | Max. 80 on 8mm T/F*6 |